(ccbbddeee3) IEEE ICBCB 2019 Conference Proceedings

Material Sciences & NanotechnologyMechanical Engineering

Conference Date

Dec 08-Dec 15, 2018

Place

ddd, Japan

Submission Deadline

Dec 11, 2018

E-mail

42439141@qq.com

Website

http://123123

Telephone

321321321321321

Description

Paper Publishing:
ICBCB 2019 papers can be published in IEEE ICBCB 2019 Conference Proceedings, reviewed by the IEEE Conference Quality Committees for IEEE Xplore, and indexed by Ei Compendex and Scopus.

Keynote Speakers:
Prof. Bijoy K. Ghosh, Texas Tech University, USA;
Prof. Ming Chen, Zhejiang University, China;
Prof. Hesham H. Ali, University of Nebraska at Omaha, USA;
Prof. Ashoka Polpitiya, Sri Lanka Technological Campus, Sri Lanka;
Prof. Ralf Hofest?dt, Bielefeld Universit

Paper Publishing:
ICBCB 2019 papers can be published in IEEE ICBCB 2019 Conference Proceedings, reviewed by the IEEE Conference Quality Committees for IEEE Xplore, and indexed by Ei Compendex and Scopus.

Keynote Speakers:
Prof. Bijoy K. Ghosh, Texas Tech University, USA;
Prof. Ming Chen, Zhejiang University, China;
Prof. Hesham H. Ali, University of Nebraska at Omaha, USA;
Prof. Ashoka Polpitiya, Sri Lanka Technological Campus, Sri Lanka;
Prof. Ralf Hofest?dt, Bielefeld Universit

Paper Publishing:
ICBCB 2019 papers can be published in IEEE ICBCB 2019 Conference Proceedings, reviewed by the IEEE Conference Quality Committees for IEEE Xplore, and indexed by Ei Compendex and Scopus.

Keynote Speakers:
Prof. Bijoy K. Ghosh, Texas Tech University, USA;
Prof. Ming Chen, Zhejiang University, China;
Prof. Hesham H. Ali, University of Nebraska at Omaha, USA;
Prof. Ashoka Polpitiya, Sri Lanka Technological Campus, Sri Lanka;
Prof. Ralf Hofest?dt, Bielefeld Universit

Paper Publishing:
ICBCB 2019 papers can be published in IEEE ICBCB 2019 Conference Proceedings, reviewed by the IEEE Conference Quality Committees for IEEE Xplore, and indexed by Ei Compendex and Scopus.

Keynote Speakers:
Prof. Bijoy K. Ghosh, Texas Tech University, USA;
Prof. Ming Chen, Zhejiang University, China;
Prof. Hesham H. Ali, University of Nebraska at Omaha, USA;
Prof. Ashoka Polpitiya, Sri Lanka Technological Campus, Sri Lanka;
Prof. Ralf Hofest?dt, Bielefeld Universit