(ICCSD 2019) 2019 IEEE 3rd International Conference on Circuits, Systems and Devices

Electronics and Electrical EngineeringSystems EngineeringSignal ProcessingCommunication Engineering

Conference Date

Aug 23-25, 2019

Place

Chengdu, China

Submission Deadline

Jul 05, 2019

E-mail

iccsd@academic.net

Telephone

+86 (0)28 8652-8629

Description

2019 3rd International Conference on Circuits, Systems and Devices (ICCSD 2019)--EI Compendex, Scopus

The 3rd International Conference on Circuits, Systems and Devices【ICCSD 2019】 will be held in 【Chengdu, China】during August 23-25, 2019. ICCSD is supported by Sichuan Institute of Electronics, UESTC, Southeast University, China and University of Detroit Mercy, USA, it will provide a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Circuits, Systems and Devices.(http://iccds.org/).

Accepted and registered papers will be published by IEEE Conference Publication. and indexed by 【EI Compendex, Scopus】 etc.

*Submission
http://confsys.iconf.org/submission/iccsd2019

*Contact
Jennifer Y. Luo
E-mail:iccsd@academic.net
Tel:+86 (0)28 8652-8629

More information about ICCSD 2019, please visit: http://iccds.org/