2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)

Systems EngineeringComputer Science and Technologies

Conference Date

Oct 22-24, 2021

Place

Nanjing, China

Submission Deadline

Sep 10, 2021

E-mail

icicm@young.ac.cn

Telephone

+86-28-87777577

Description

★ICICM 2021--IEEE Xplore,Ei Compendex and Scopus★

Full Name: 2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)--EI Compendex, Scopus
Abbreviation: ICICM 2021
Time: October 22-24, 2021
Place: Nanjing,China
Website: http://www.icicm.net/

==Submission Deadline:
(For early submission, it will get the feedback within 1 month)
==Publication: Conference Proceeding
==Indexed by: Ei Compendex, and Scopus, etc.
==Submission email: icicm@young.ac.cn (Or you still can submit to the submission system https://easychair.org/conferences/?conf=icicm2021)
==Find the tempalte with the link: http://icicm.net/files/Template.doc

★Co-sponsored by★
University of Electronic Science and Technology of China, China
Technology of China and Southeast University, China

★ICICM Committees★
Advisory Chairs:
David Z. Pan, The University of Texas at Austin, United States (IEEE Fellow, SPIE Fellow);
Ljiljana Trajkovic, Simon Fraser University, Canada (IEEE Fellow).

Conference Chairs:
Zhigong Wang, Southeast University, China;
Li Qiang, University of Electronic Science and Technology of China, China(Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter).

Program Chairs:
Fei Yuan, Ryerson University, Canada(Senior Member of IEEE and IET Fellow);
Zou Zhuo, Fudan University, China(Senior Member of IEEE);
Liu Dake, Beijing Institute of Technology, China | Linköping University, Sweden.

Steering Committee Chair:
Huang Le Tian, University of Electronic Science and Technology of China, China

Technical Committee:
Zhenhai Chen, Hefei University of Technology, China;
Junji Cheng, University of Electronic Science and Technology of China, China;
Pan Dai, Huzhou University, China;
Quanzhen Duan, Tianjin University of Technology, China;
Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi Arabia;
Shengming Huang, Tianjin University of Technology, China;
Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan;
Xiangliang Jin, Hunan Normal University, China;
Biba Josef, Universität der Bundeswehr München, Germany;
Atsushi Kurokawa, Hirosaki University, Japan;
Wen Cheng Lai, National Taiwan University of Science and Technology, Taiwan;
Qi Li, Guilin University of Electronic Technology, China;
Weiguang Sheng, Shanghai Jiao Tong University, China;
Chunyi Song, Zhejiang University, China;
Haizhi Song, University of Electronic Science and Technology of China, China;
Jiajia Sun, China Academy of Space Technology, China;
Lu Tang, Southeast University, China;
Somboon Theerawisitpong, Rajamangala University of Technology Thanyaburi, Thailand;
Wensi Wang, Beijing University of Technology, China;
Weilin Xu, Guilin University of Electronic Technology, China;
Jong-Ryul Yang, Yeungnam University, South Korea;
Changchun Zhang, Nanjing University of Posts and Telecommunications, China.
For more members, please visite conference website: http://www.icicm.net/committee.html

★History★
<ICICM2020 | IEEE Publisher | Nanjing,China | October 23-25, 2020>
Papers of ICICM2020 can be checked in IEEE Xplore!
Electronic ISBN: 978-1-7281-8978-9 | USB ISBN: 978-1-7281-8977-2

<ICICM2019 | IEEE Publisher | Beijing, China | October 25-27, 2019>
Papers of ICICM2019 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1

<ICICM2018|IEEE Publisher|Shanghai,China|Nov.24-26, 2018>
Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5

<ICICM2017|IEEE Publisher|Nanjing,China|Nov.8-11,2017>
Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0

<ICICM2016|IEEE Publisher|Chengdu,China|Nov.23-25, 2016 >
Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3

★Topics★
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

★Conference Contact★
Ms Zeng
Email: icicm@young.ac.cn
Tel: +86-28-87777577
Web: www.icicm.net