(ICICM 2024) 2024 The 9th International Conference on Integrated Circuits and Microsystems

Electronics and Electrical EngineeringSystems EngineeringComputer Science and Technologies

Conference Date

Oct 25-27, 2024

Place

Wuhan, China

Submission Deadline

Apr 30, 2024

E-mail

icicm_conf@vip.163.com

Telephone

(86)134-0855-5552

Description

★IEEE ICICM2024--Ei Compendex,Scopus--Wuhan, China★

★Full name: IEEE--2024 The 9th International Conference on Integrated Circuits and Microsystems (ICICM 2024)
★Abbreviation: ICICM 2024
**Place: Wuhan, China
**Time: October 25-27, 2024
**Website: http://icicm.net/

★Co-Sponsored by:
==Southeast University, China
==University of Electronic Science and Technology of China, China
==Wuhan University of Technology, China

==Submission==
1. Full paper (publication and presentation)
2. Abstract (presentation only)
**Electronic submission system: https://easychair.org/conferences/?conf=icicm2024
**Email submission: icicm_conf@vip.163.com
More detail about submission, please visit at http://icicm.net/submission.html

=Publication=
The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc.
***ICICM2016-2023 has been successfully indexed by EI Compendex and Scopus already!

=Topics (include but not limit)=
► Devices and Circuits for Wirless System
► Application Specific Circuits and Systems for Communication
► Digital, Analog, Mixed Signal IC and SOC design technology
► Silicon integrated circuits and manufacturing
► Low-power, RF devices & circuits
► IC Computer-Aided –Design technology, DFM
► Silicon/germanium devices and device physics
► Interconnect, Low K, High K and other process technologies
► Unconventional and nano-electronics
► Organic semiconductor devices and technologies
► Compound semiconductor devices and circuits
► Displays, sensors and MEMS
► Semiconductor materials and material characterization
► Packaging and testing technology
► Solar cell & other devices for new energy sources
► Modeling and simulation
► Equipment technology
► Reliability
► Displays, sensors and MEMS
► Advance memories technology
For more topics, please visit at: http://icicm.net/call-for-papers.html

==Organizing Committee==
**Advisory Chairs
Pui-in Mak, University of Macau, Macau, China
Ljiljana Trajkovic, Simon Fraser University, Canada

**Conference Chairs
Zhigong Wang, Southeast University, China
Chen Liu, Nanjing University of Posts and Telecommunica