(ICMPM 2019) 2019 6th International Conference on Mechanical Properties of Materials

Material Sciences & NanotechnologyElectronics and Electrical EngineeringMechanical Engineeringmanufacturing

Conference Date

Jul 23-25, 2019

Place

Paris, France

Submission Deadline

May 20, 2019

E-mail

icmpm@outlook.com

Telephone

+00-852-30756684

Description

2019 6th International Conference on Mechanical Properties of Materials (ICMPM 2019)--Ei Compendex, Scopus

Welcome to ICMPM 2019
http://www.icmpm.org/

2019 6th International Conference on Mechanical Properties of Materials (ICMPM 2019) will be held in Paris, France during July 23-25, 2019.

Paper Publication
Option I. All accepted papers must be written in English and will be published in the conference proceedings, will be submitted for *Ei Compendex*, *Scopus* index.
Option II. International Journal of Materials, Mechanics and Manufacturing(ISSN: 1793-8198/DOI: 10.18178/IJMMM), Abstracting/Indexing: EI (INSPEC, IET), Chemical Abstracts Services (CAS), ProQuest, Crossref, Ulrich's Periodicals Directory, etc.

Submission Methods
1. Full Paper (Presentation and publication)
2. Abstract (Presentation only)
Please log in the Electronic Submission System(http://confsys.iconf.org/submission/icmpm2019)
or submit paper to: icmpm@outlook.com.

Conference Venue: Timhotel Paris Berthier
Address: 4 Boulevard Berthier, 17th arr., 75017 Paris, France

Lab visit could be arranged on July 25, 2019 in Paris, France, or one day tour could be arranged on July 25, 2019 in Paris, France.

Contact us
Conference Secretary: Mr. Jack Feng
E-mail: icmpm@outlook.com
Tel: +00-852-30756684