2020 The 3rd International Conference on Smart Materials Applications (ICSMA 2020)

Material Sciences & Nanotechnology

Conference Date

Jan 13-16, 2019

Place

Seoul, Mongolia

Submission Deadline

Oct 15, 2019

E-mail

icsma@saise.org

Telephone

+852-30717761

Description

The 3rd International Conference on Smart Materials Applications (ICSMA 2020) will take place in Yonsei University, Seoul, South Korea during January 13-16, 2020.

ICSMA2020 is co-organized by South Asia Institute of Science and Engineering (SAISE) and Yonsei University, South Korea.

More details, please visit: http://www.icsma.org

Conference Proceedings:
All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, which is indexed by Ei Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al.

Submission:
By Email: icsma@saise.org
By online submission system: http://confsys.iconf.org/submission/icsma2020