(ICESP 2025) 2025 6th International Conference on Electronics and Signal Processing

Electronics and Electrical EngineeringSignal Processing

Conference Date

Jan 10-Jan 12, 2025


Hong Kong, China

Submission Deadline

Aug 20, 2024






★ICESP 2025-Ei Compendex and Scopus★

Abbreviation: ICESP 2025
Full Name: Springer--2025 6th International Conference on Electronics and Signal Processing (ICESP 2025)
Venue: Hong Kong, China
Time: January 10-12, 2025
Web: http://www.icesp.org/

Submissions will be peer reviewed by both the conference scientific committees and journal editorial board. All registered and presented papers will be published in Springer book series-Signals and Communication Technology, submitted for Scopus, EI Compendex, SCImago, zbMATH, etc.

★Submission Methods:
1. Full paper(publication and presentation)
2. Abstract (presentation)

For full paper, please upload it to the Electronic Submission System (.pdf) http://confsys.iconf.org/conference/icesp2025
For abstract, please send it to: icesp_conf@163.com
More detail about submission, please visit: http://www.icesp.org/submission.html

★Topics of Interest for Submission:
Array Signal Processing
Audio and Electroacoustics
Bioimaging and Signal Processing
Digital Signal Processing
Hardware Implementation for Signal Processing
Image and Multidimensional Signal Processing
Machine Learning for Signal Processing
Next Generation Mobile Communications
Radar Signal Processing
Signal Processing and Communications Education
Soft Computing and Machine learning for Signal Processing and Communications
Speech and Audio Coding
Video compression & Streaming
Watermarking and Information Hiding

More topics: http://www.icesp.org/cfp.html

★Conference Venue
University of Hong Kong, Hong Kong, China
ADD: Pok Fu Lam, Hong Kong Island, Hong Kong, China

Ms. Fiona
Email: icesp_conf@163.com
Phone: +86-13731111131
9:30am--12am, 2pm-5:30pm, Monday to Friday