Systems EngineeringCommunication EngineeringComputer Science and Technologies

★IEEE| ICICM 2026--Ei Compendex,Scopus--Xi'an, China★Hosted by Xi'an Jiaotong University★
★10 Years EI Compemdex Indexing★
★Special Awards for Encouragement: Young Scientist Award, Best Paper Award, Best Student Paper Award, Best Organization Award, etc.★

★Co-Sponsored by:
==Xi'an Jiaotong University
==Southeast University
==University of Electronic Science and Technology of China

★Hosted by:
==Xi'an Jiaotong University

==Submission==
1. Full Paper with at least 4 full pages (Presentation and Publication)
Template Download in Word: https://www.icicm.net/files/Template.doc
Template Download in Latex: https://www.icicm.net/files/IEEE-conference-proceeding-Latex.rar
2. Abstract within 300-500 words (Presentation only)
*All manuscripts must be written in English.

★ Electronic submission system: https://easychair.org/conferences/?conf=icicm2026
★ Email submission: icicm_conf@vip.163.com
More detail about submission, please visit at http://icicm.net/submission.html

=Publication=
Submitted papers will be Peer-Reviewed (Double Blind) and the accepted ones will be collected in the IEEE conference proceedings, included in IEEE Xplore and indexed by EI Compendex and Scopus.
***ICICM2016-2024 (previous 9 years) have been successfully indexed by EI Compendex and Scopus already!

=Topics (include but not limit)=
Track 1: Electronic Design Automation (EDA)
• Progress of EDA algorithms
• EDA for emerging technologies
• Hardware-software co-design with EDA
• EDA in High Performance Computing (HPC)
• EDA in analog and mixed-signal design

Track 2: Integrated Circuit and System Design
• Digital, analog, mixed-signal IC and SOC design technology
• IC computer-aided design technology, DFM
• Modeling and simulation

Track 3: Semiconductor Devices and Circuits
• Components and circuits for wireless systems
• Low power, RF devices and circuits
• Silicon/Germanium Devices and Device Physics
• Compound semiconductor devices and circuits

Track 4: Process Technology and Manufacturing
• Silicon integrated circuits and manufacturing
• Interconnect, low-K, high-K and other process technologies
• Packaging and testing technology, equipment technology

For more topics, please visit at: http://icicm.net/call-for-papers.html

==Organizing Committee==
Conference Chairs:
Zhigong Wang, Southeast University, China;
Xiulong Wu, Anhui University, China;
Kaixue Ma, Tianjin University, China.

Conference Co-Chairs:
Ning Xu, Wuhan University of Technology, China;
Xiaoqing Wen, Kyushu Institute of Technology, Japan;
Qiang Li, University of Electronic Science and Technology of China, China.

Program Chairs:
Abdel-Hamid Ali Soliman, Staffordshire University, UK;
Jun Han, Fudan University, China;
Xiaopeng Yu, Zhejiang University, China;
Meng Zhang, Southeast University, China;
Sheng Chang, Wuhan University, China;
Yingmei Chen, Southeast University, China;
Zhikuang Cai, Nanjing University of Posts and Telecommunications, China;
Zhuo Zou, Fudan University, China (IEEE Senior Member);
Jianguo Hu, Sun Yat-sen University , China;
Bei Yu, The Chinese University of Hong Kong , China.

Program Co-Chairs:
Junyong Deng, Xi'an University of Posts & Telecommunications, China;
Jun Xu, Nanjing University, China;
Zhixiong Di, Southwest Jiaotong University, China;
Guojie Luo, Peking University, China;
Xiaojun Zhai, University of Essex, UK;
Wei Xing, The University of Sheffield, UK.

Program Committee:
Bo Liu, Southeast University, China;
Shi Pu, Wuhan University of Technology , China;
Haizhi Song, University Of Electronic Science And Technology Of China, China;
Lu Zhu, Sun Yat-sen University, China;
Youming Zhang, Southeast University, China;
Jianshi Tang, Tsinghua University, China;
Weiguang Sheng, Shanghai Jiao Tong University, China;
Hao Gao, Austria & Eindhoven University of Technology, The Netherland;
Yun Fang, Silicon Austria Labs, Austria;
Jeff Kilby, Auckland University of Technology, New Zealand;
Zhijun Zhou, Southeast University, China;
Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China;
Wei Hu, Northwestern Polytechnical University, China;
Zhaori Bi, Fudan University, China;
Zhengfeng Huang, Hefei University of Technology, China.

Local Chair:
Lin Cheng, University of Science and Technology of China.

Student Program Chairs:
Hongbin Sun, Xi'an Jiaotong University, China;
Keping Wang, Tianjin University, China;
Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China;
Fanyi Meng, Tianjin University, China.

Student Program Committee:
Li Du, Nanjing University, China;
Lei Wang, Nanjing University Of Posts And Telecommunications, China;
Xianbo Li, Sun Yat-sen University, China;
Tiehu Li, Chongqing University of Technology, China;
Moufu Kong, University of Electronic Science and Technology of China, China;
Jiaxin Liu, University of Electronic Science and Technology of China, China;
Maliang Liu, Xidian University, China;
Xu Meng, Hefei University of Technology, China;
Tianming Ni, Anhui University of Engineering, China;
Qiang Zhao, Anhui University, China.

More Organizing Committee list, please visit: https://icicm.net/committee.html

==History==
ICICM2016 | Chengdu on November 23-25, 2016
ICICM2017 | Nanjing on November 8-11, 2017
ICICM2018 | Shanghai on November 24-26, 2018
ICICM2019 | Beijing on October 25-27,2019
ICICM2020 | Nanjing on October 23-25, 2020
ICICM2021 | Nanjing on October 22-24, 2021
ICICM2022 | Xi'an on October 28-31, 2022
ICICM2023 | Nanjing on October 20-23, 2023
ICICM2024 | Wuhan on October 25-27, 2024
ICICM2025 | Hefei on October 17-19, 2025

=Contact us=
Ms. Carrie Lim