Systems Engineeringinformation scienceITcomputingCommunication EngineeringComputer Science and Technologies

ISSCC 2027 will be held February 14-18, 2027 at the San Francisco Marriott Marquis and features an exhibition space for companies and research institutions to showcase their work.

Important Submission Updates & Information
1. NEW A figure density checking tool, the ISSCC Figure Density Check, helps you confirm your figures are readable. Authors must confirm at submission that they have used the tool..
2. NEW At submission, authors declare and explain any potential conflicts of interest (COI) with iTPC members of the selected subcommittees. This step is completed in the submission form; detailed guidelines are on the Submissions Website.
3. NEW ISSCC 2027 introduces Open Science Badges (Open Design / Open Data) to recognize sharing the artifacts behind your paper. Voluntary; badges are assigned after acceptance.
4. Make sure that ALL related work is sufficiently referenced, including your own. Undisclosed pre-publications may lead to withdrawal of an accepted paper.
5. Submissions with a clear blind-review violation are penalized during Paper Selection, affecting acceptance, awards, and the JSSC Special Issue invitation. Notifying Program Committee members outside your organization of your submission results in immediate rejection.

Tutorials
There are a total of 10 tutorials this year on 10 different topics. Each tutorial, selected through a competitive process within each subcommittee of the ISSCC, presents the basic concepts and working principles of a single topic of broad interest. The tutorials are intended for non-experts, graduate students, and practicing engineers who wish to explore and understand a new topic. Tutorial registration bundles access to all 10 of the tutorials. Participants are asked to select between the option for only on-demand access to the tutorials (provided ahead of the conference) or the option to additionally attend a full-day live Q&A and networking session with the presenters during the conference, at no additional charge. This year the tutorial topics are:
Fundamentals of Circuit Design for Safe Robotics and Autonomous Vehicles
Fundamentals of Switched-Capacitor Power Converter Designs
Fundamentals of Adaptive Clocking for Energy Efficient Processors
Basics of Time-Domain ADCs: Principle and Simulation
Machine Learning Accelerator Design Methodology
Fundamentals of Supply-to-Digital Conversion for Multi-Modal Sensing with Energy-Harvesting
Fundamentals of LO Frequency Scaling and Distribution Techniques for mm-Wave
Foundations and Frontiers in Analog Circuit Design Automation
Fundamentals of LO Generation for Radar and Sensing
Basics of Die-to-Die Interface Circuits

Forums
There are a total of six Forums this year on six different topics. In each Advanced-Circuit-Design Forum, selected through a competitive process within each subcommittee of the ISSCC, leading experts present state-of-the-art design strategies. The Forums are targeted at designers experienced in the technical field. The registration offers a bundle to attend all Forums in person, a bundle to attend in person all Forums on Sunday or on Thursday, and a bundle to access all Forums only on-demand. The in-person bundles will enable also on-demand access to the same content chosen for live attendance.
Next-Generation AI and HPC Through Memory, Interconnect, Power, and Architecture Co-Design
Data Converters at the Bottleneck: Scaling ADC/DAC Design for 448G–3.2T Wireline Links
Emerging Electrical and Optical Connectivity: From System Architecture to Circuits
AI Optimized Sensing: Approaching Physical World Through Co-Designed Sensors and AI
Towards 6G: Circuits and Systems for Joint Communication, Sensing, and Edge AI
Enabling the Quantum Revolution: Silicon Systems for High-Precision Quantum Sensing and Computing