For university researchers, doctoral candidates, and industry engineers, presenting original empirical research at peer-reviewed international conferences is a critical step for academic dissemination and professional advancement. Securing publication in official proceedings indexed by major databases such as EI Compendex and Scopus guarantees global visibility and citation impact.
Below is a curated directory of high-level international academic conferences scheduled across late 2026 with open Calls for Submissions across artificial intelligence, power engineering, cloud computing, and cybersecurity.

Technical Sponsor / Publisher: IEEE
Submission Deadline: August 5, 2026
Conference Dates: November 20, 2026 – November 22, 2026
Location: Hangzhou, China
Primary Discipline: Artificial Intelligence, Data Privacy, Algorithmic Governance, Trustworthy Computing
Indexing: EI Compendex, Scopus
Official Website:
Contact Email: icaisg_contact@yeah.net
Sponsored by IEEE, ICAISG 2026 addresses pressing challenges at the intersection of security and artificial intelligence, including data privacy preservation, secure machine learning frameworks, and robust AI governance mechanisms.
Publisher: ACM
Submission Deadline: August 5, 2026
Conference Dates: December 18, 2026 – December 21, 2026
Location: Tokyo, Japan
Primary Discipline: Computer Science, Distributed Cloud Architectures, High-Performance Computing, AI in Cloud Systems
Indexing: EI Compendex, Scopus
Official Website:
Contact Email: aiccc.contact@gmail.com
Published in official ACM proceedings, AICCC 2026 serves as a major international platform in Tokyo covering virtualization, cloud software engineering, distributed middleware, and AI-driven cloud management.
Publisher: IEEE
Submission Deadline: August 1, 2026
Conference Dates: November 13, 2026 – November 15, 2026
Location: Guangzhou, China
Primary Discipline: Electrical & Power Engineering, Industrial Control, Energy Conversion Automation
Indexing: EI Compendex, Scopus
Official Website:
Contact Email: pcce_conf@vip.163.com
Sponsored by IEEE, PCCE 2026 gathers power electronics researchers and feedback control engineers to share advancements in power converter topologies, smart grids, and automated control systems.
Submission Deadline: August 1, 2026
Conference Dates: December 19, 2026 – December 21, 2026
Location: Harbin, China
Primary Discipline: Cybersecurity, Cryptography, Network Protocols, Threat Detection
Indexing: EI Compendex, Scopus
Official Website:
Contact Email: iccns_secretary@young.ac.cn
Celebrating its 16th edition, ICCNS 2026 provides a long-standing forum for cybersecurity experts, network architects, and cryptographic system developers.
| Conference Abbr. | Primary Discipline | Host Location | Dates | Indexing |
| ICAISG 2026 | AI Safety & Governance | Hangzhou, China | Nov 20–22, 2026 | EI Compendex, Scopus |
| AICCC 2026 | Cloud Computing & AI | Tokyo, Japan | Dec 18–21, 2026 | EI Compendex, Scopus |
| PCCE 2026 | Power & Control Engineering | Guangzhou, China | Nov 13–15, 2026 | EI Compendex, Scopus |
| ICCNS 2026 | Communication & Network Security | Harbin, China | Dec 19–21, 2026 | EI Compendex, Scopus |
Authors preparing manuscripts for inclusion in EI Compendex and Scopus indexed proceedings should follow standard technical requirements:
Originality: Submissions must present original, unpublished empirical research that is not currently under peer review elsewhere.
Template Compliance: Manuscripts must strictly conform to publisher style guidelines (e.g., IEEE standard two-column format or ACM manuscript layout).
Peer Evaluation: Submissions undergo double-blind or single-blind peer review by international technical program committees based on technical soundness, methodology, and scientific novelty.
Publication & Indexing: All accepted and registered full papers delivered at the conferences will be published in official proceedings and submitted directly for indexing in EI Compendex and Scopus databases.
Prospective authors are advised to upload their papers prior to deadline expiration via the official submission web portals listed above.