The rapid advancement of automation,additive manufacturing, and electronic systems is reshaping the mechanicalengineering landscape. For researchers, engineers, and manufacturingprofessionals aiming to publish their latest innovations and connect withinternational peers, targeting specialized, high-impact conferences is anessential step.
Below is a curated selection of premieracademic conferences focusing on intelligent manufacturing and mechanicalengineering that are currently accepting paper submissions for the second halfof 2026:
1. 2026 14th International Conference onControl, Mechatronics and Automation (ICCMA 2026)
- Themes: Engineering Technology, Automation Science, Electrical & Electronic Engineering, Mechanical Engineering, Control
- Index Type: Ei Compendex, Scopus
- Publication: IEEE (Conference Proceedings)
- Submission Deadline: August 25, 2026
- Conference Dates: November 3 – November 5, 2026
- Location: Bari, Italy
- Official Website: http://iccma.org/
- Contact Email: iccma@chairmen.org
2. 2026 International Conference onAdditive Manufacturing and Bio-Manufacturing (ICAM-BM2026)
- Organizers: Tsinghua University and Chinese Mechanical Engineering Society
- Themes: Engineering Technology, Materials Science & Nanotechnology, Manufacturing
- Index Type: Other
- Submission Deadline: September 1, 2026
- Conference Dates: October 13 – October 15, 2026
- Location: Beijing, China
- Official Website: https://www.icam-bm.com/
- Contact Email: conference@icam-bm.com
3. 2026 12th International Conference onMechanical and Electronic Engineering (ICMEE 2026)
- Themes: Engineering Technology, Automation Science, Electrical & Electronic Engineering, Mechanical Engineering
- Index Type: Ei Compendex, Scopus
- Publication: IEEE (Conference Proceedings)
- Submission Deadline: September 1, 2026
- Conference Dates: December 29 – December 31, 2026
- Location: Guangzhou, China
- Official Website: https://www.icmee.org/
- Contact Email: icmee@academic.net
4. 2026 11th International Conference onIntegrated Circuits and Microsystems (ICICM 2026)
- Organizers: IEEE, IEEE CAS, Xi'an Jiaotong University, Southeast University, and University of Electronic Science and Technology of China
- Themes: Engineering Technology, Electrical & Electronic Engineering, Mechanical Engineering, Engineering
- Index Type: Ei Compendex, Scopus
- Publication: IEEE (Conference Proceedings)
- Submission Deadline: August 25, 2026
- Conference Dates: October 16 – October 18, 2026
- Location: Xi'an, China
- Official Website: http://icicm.net/
- Contact Email: icicm_conf@vip.163.com
The conference information provided inthis article is for reference only. Please refer to the official conferencewebsite for all final and authoritative details.
